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Design And Analysis Of Heat Sinks Pdf

design and analysis of heat sinks pdf

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In this study, an optimal design method for minimizing the size of plate fin heat sinks subject to natural convection is proposed.

An analytic model for predicting the thermal resistance of a fin array, as well as the heat sink substrate, is developed. In order to validate the analytic results, we performed numerical study and experimental studies. Based on the validated analytic results, we suggest an algorithm for minimizing the size of a natural convective plate fin heat sink subject to a constant thermal resistance.

As the substrates thickness increases, the substrates conduction thermal resistance decreases while the convection thermal resistance decreases as the fin height increases. The minimum heat sink size is determined by a balance between those two competing effects.

The minimum heat sink size is shown to increase as the heat source localization intensity increases. This is a preview of subscription content, access via your institution. Rent this article via DeepDyve. Oktay, R. Hannemann and A. Bar-Cohen, Mech. Google Scholar. Bar-Cohen, M. Iyengar and A. Klaus, J. Heat Trans. Incropera, J. Nakayama, App. Welling and C. Wooldridge, J. Skandakumaran, V. Khanikar, M. Smalc, J. Norley and B. Reis, Therm. Starner and H.

McManus Jr. Tierney, J. Bilitsky, M. Culham, T. Lemcyzk, S. Lee and M. Yovanovich, Heat Trans. Culham, M. Yovanovich and S. A 18 , Narasimhan, J. Majdalani and S.

A 25 , 78 Higuera and Y. Ryazantsev, Int. Heat Mass Trans. Lorente and A. Bejan, Num. A 45 , Floryan and M.

Novak, Int. Heat Fluid Flow 16 , Kraus and A. Incropera and D. DeWitt, Fundamentals of heat and mass transfer , fifth ed. Byon, K. Choo and S. Kim, Int. Muzychka, J. Culham and M. Yovanovich, J. Download references. Correspondence to Chan Byon. Reprints and Permissions. Byon, C. Optimal design method for plate fin heat sinks subject to natural convection. Journal of the Korean Physical Society 65, — Download citation.

Received : 01 December Accepted : 20 August Published : 06 December Issue Date : November Search SpringerLink Search. Abstract In this study, an optimal design method for minimizing the size of plate fin heat sinks subject to natural convection is proposed.

References [1] S. Elenbaas, Physica 9 , Rights and permissions Reprints and Permissions. About this article. Cite this article Byon, C.

Optimal design method for plate fin heat sinks subject to natural convection

In this study, an optimal design method for minimizing the size of plate fin heat sinks subject to natural convection is proposed. An analytic model for predicting the thermal resistance of a fin array, as well as the heat sink substrate, is developed. In order to validate the analytic results, we performed numerical study and experimental studies. Based on the validated analytic results, we suggest an algorithm for minimizing the size of a natural convective plate fin heat sink subject to a constant thermal resistance. As the substrates thickness increases, the substrates conduction thermal resistance decreases while the convection thermal resistance decreases as the fin height increases. The minimum heat sink size is determined by a balance between those two competing effects. The minimum heat sink size is shown to increase as the heat source localization intensity increases.

Optimal design method for plate fin heat sinks subject to natural convection

A heat sink also commonly spelled heatsink [1] is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes LEDs , where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air.

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In this article, we will learn about Heat Sink and different aspects of Heat Sinks like what is a heat sink, what are the types of heat sinks, what is active cooling and passive cooling etc. A straight fin heat sink is cut at regular intervals. As the amount of power dissipation in the device increases, the size of the heat sink must increase to allow more surface area to be exposed to the ambient. Next, the equivalent circuit of an IGBT 2-pack-module and a diode bridge mounted on a heat sink is shown in Fig. Typically, airflow is either classified as natural or forced convection.

A heat sink also commonly spelled heatsink [1] is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes LEDs , where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit.

Вопреки широко распространенному мнению о том, что такой компьютер создать невозможно, АНБ осталось верным своему девизу: возможно все; на невозможное просто требуется больше времени. Через пять лет, истратив полмиллиона рабочих часов и почти два миллиарда долларов, АН Б вновь доказало жизненность своего девиза. Последний из трех миллионов процессоров размером с почтовую марку занял свое место, все программное обеспечение было установлено, и керамическая оболочка наглухо заделана. ТРАНСТЕКСТ появился на свет.

1 Comments

  1. Avril M.

    07.05.2021 at 23:58
    Reply

    Other topics covered include: * Fundamentals of heat transfer. * Thermal modeling of electronic packages. * Mathematical tools for heat-sink analysis and design. *.

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